Photo by Amelia Holowaty Krales / The Verge

Qualcomm has just announced the 3D Sonic Sensor Gen 2, the latest version of its ultrasonic in-display fingerprint sensor that looks to improve on the original model in nearly every way. The new version offers a larger surface area for the sensor and faster processing to unlock phones even quicker.

The company is making a big jump here: the new Gen 2 model measures 8mm x 8mm, compared to the 4mm x 9mm surface area of the first-generation model, for 77 percent more surface area. In turn, that means it’ll be easier to accurately place your finger on the sensor, and it allows for the sensor to collect more data with each scan. By combining the larger sensor with faster processing, Qualcomm promises that scanning a fingerprint to unlock a…

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Source:: Theverge – Tech


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